Pad Sockets

Pad Sockets

Overview

  • Material : Silicon Rubber with conductive particles.
  • Damage-free contact on BGA Ball.
  • Easy handling(replacing).

Rubber PAD Structure and Performance

 Features

No damage to loading board and solder ball.

 

Superior performance for frequency testing that requires low inductance, low resistance, and low contact force characteristics.


Cost effective performance for high pin count package testing.
1.27mm ~0.5mm pitch Standard for LGA/BGA
  ~0.4mm pitch Standard for LGA/BGA
  ~0.3mm pitch Standard for LGA/BGA
  ~0.2mm pitch Development/Trial for LGA/BGA

Conductive particles(Au-coat) & silicon structure – Suitable for rubber socket

SUS Frame Rubber

  • Size (mm) : 16.4 x 22 x 0.4(t) ~ 0.85 (t)
  • Device Size Range (mm) : 4 x 4 x 0.6(t) ~ 18 x 18 x 2.4(t)
  • Pitch Range : Min 0.4
  • Material : sus & silicon
  • Max Stroke (mm) : 0.2
  • Temp Range : -25?~ 125?
  • Contact Force : 16g / PIN

BT Frame Rubber

  • Size (mm) : 16.4 x 22 x 0.4(t) ~ 0.85 (t)
  • Device Size Range (mm) : 4 x 4 x 0.6(t) ~ 18 x 18 x 2.4(t)
  • Pitch Range : Min 0.4
  • Material : BT & silicon
  • Max Stroke (mm) : 0.2
  • Temp Range : -25?~ 125?
  • Contact Force : 16g / PIN

Wire Frame Rubber

  • Size (mm) : 50 x 50 x 0.4(t) (Cut out)
  • Device Size Range (mm) : 4 x 4 x 0.6(t) ~ 18 x 18 x 2.4(t)
  • Pitch Range : Min 0.4
  • Max Stroke (mm) : 0.15
  • Temp Range : -20?~ 125?